AGING RESPONSE AND CRYOGENIC MECHANICAL PROPERTIES OF AN In-Sn EUTECTIC SOLDER ALLOY FOR JOSEPHSON PACKAGING.
- T. Caulfield
- S. Purushothaman
- et al.
- 1983
- International Cryogenic Materials Conference 1983
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3 results for David P. Waldman
Controlled Collapse Reflow for Josephson Chip Bonding
- C.-Y. Ting
- K.R. Grebe
- et al.
- 2019
- JES
Packaging Technology for Josephson Integrated Circuits
- Syamal K. Lahiri
- H. Randall Bickford
- et al.
- 1982
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology