Co-packaged optics module with single mode polymer waveguide

We present co-packaged optics (CPO) modules featuring single-mode polymer waveguide (PWG) fiber interfaces to address the growing demand for high-bandwidth, energy-efficient interconnects in AI systems. Compared to conventional fiber connections, PWGs offer higher optical lane density and easier assembly. We evaluated two substrate configurations and conducted mechanical and thermomechanical reliability testing. Results showed stable adhesion, low insertion loss (<1.2–2.0 dB), and resilience under thermal stress. A 3-port CPO module with a cut-out substrate demonstrated the feasibility of optics-last assembly. These findings support PWG-integrated CPO modules as a promising solution for future heterogeneous chiplet-based AI hardware platforms.