Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
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- ECTC 2026
Conference paper
Publications
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Co-packaged optics module with single mode polymer waveguide
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- 2025
- IEDM 2025
Invited talkReliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
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- Katherine Pilger
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Conference paper