Publications

4 results for Hiroyuki Mori

Co-packaged optics module with single mode polymer waveguide
- - Akihiro Horibe
  - Yoichi Taira
  - et al.
- 2025
- IEDM 2025
Simulation Analysis of Organic-Substrate-Embedded-Thermal-Solution in A Flip-Chip Package Called Power Insert
- - Keiji Matsumoto
  - Daisuke Oshima
  - et al.
- 2025
- MATE 2025
Thermal and Mechanical Analysis of Embedded Liquid Cooling with Microchannel and Pin-fin Structures
- - Risa Miyazawa
  - Hiroyuki Mori
  - et al.
- 2024
- ITherm 2024
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- - Sathya Raghavan
  - Hiroyuki Mori
  - et al.
- 2023
- ECTC 2023