PaperMechanisms for microstructure evolution in electroplated copper thin films near room temperatureJ.M.E. Harper, C. Cabral Jr., et al.Journal of Applied Physics
Conference paperCorrelation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnectsL. Gignac, C.-K. Hu, et al.Microelectronic Engineering
PaperComputer simulation of the imaging of magnetic domains in the scanning electron microscopeJ.P. Jakubovics, O.C. WellsJournal of Magnetism and Magnetic Materials
PaperElectromigration in on-chip single/dual damascene Cu interconnectionsC.-K. Hu, L. Gignac, et al.JES
