Interconnect and circuit modeling techniques for full-chip power supply noise analysis
- Howard H. Chen
- J. Scott Neely
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
13 results at IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Low-cost fabrication of optical subassemblies
- Mitchell S. Cohen
- Glen W. Johnson
- et al.
- 1997
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Electrical characteristics of high-performance pin-in-socket and pad-on-pad connectors
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 1997
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Modeling and design of antennas for RF wireless systems
- Saila Ponnapalli
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Broadband characterization of low dielectric constant and low dielectric loss CYTUF™ cyanate ester printed circuit board material
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Adhesion enhancement and lamination of polyimide films
- Nancy C. Stoffel
- Meng Hsieh
- et al.
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Evaluation of Contact Resistance for Isotropic Electrically Conductive Adhesives
- Ravi F. Saraf
- Judith M. Roldan
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Integrated Flex: Rigid-Flex Capability in a High Performance MCM
- Charles R. Davis
- John S. Kresge
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Latent Open Defect Detection Using Phase-Sensitive Nonlinearity Detection Technique
- Thomas H. DiStefano
- Shinwu Chiang
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Thin Film Transfer Process for Low Cost MCM-D Fabrication
- C. Narayan
- S. Purushothaman
- et al.
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B