Post Tungsten CMP Cleaning: Optimization for Cleaning Efficiency and Corrosion Reduction
- Wei-Tsu Tseng
- Pinlei Chu
- et al.
- 2024
- ECS J. Solid State Sci. Technol.
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Application of Cu Reflow Process on Ru Liner for Advanced Nanoscale Interconnects
- K. Motoyama
- O. van der Straten
- 2024
- ECS J. Solid State Sci. Technol.
Molecular Interactions in Copper Chemical Mechanical Planarization: A Phenomenological Study
- Mahadevaiyer Krishnan
- Donald F. Canaperi
- et al.
- 2024
- ECS J. Solid State Sci. Technol.
Crystallization Properties of Al-Sb Alloys for Phase Change Memory Applications
- Rubab Ume
- Haibo Gong
- et al.
- 2021
- ECS J. Solid State Sci. Technol.
Understanding the Reasons behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes
- Y. Sampurno
- A. Philipossian
- et al.
- 2021
- ECS J. Solid State Sci. Technol.
Process Co-Optimization of CVD and CMP for Tungsten Metallization
- Shanti Pancharatnam
- Wei Tsu Tseng
- et al.
- 2020
- ECS J. Solid State Sci. Technol.
CMP development for Ru liner structures beyond 14nm
- Raghuveer Patlolla
- Koichi Motoyama
- et al.
- 2018
- ECS J. Solid State Sci. Technol.
Accurate measurement of porous low-k thin-films by nanoindentation: Densification scaling versus substrate effects
- Krystelle Lionti
- Kumar Virwani
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
A study on the long-term degradation of crystalline silicon solar cells metallized with Cu electroplating
- Qiang Huang
- Kathleen B. Reuter
- et al.
- 2015
- ECS J. Solid State Sci. Technol.