Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
- Thomas Brunschwiler
- Raúl Mroßko
- et al.
- 2016
- ESTC 2016
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3 results at ESTC 2016
Intra-stack sealing of tier interconnects using the interconnect alloy
- Jessica Kleff
- Gerd Schlottig
- et al.
- 2016
- ESTC 2016
Exploration of inductor-based hybrid integrated voltage regulator architectures
- Arvind Sridhar
- Thomas Brunschwiler
- et al.
- 2016
- ESTC 2016