Spectral Interferometry for TSV Metrology in Chiplet Technology
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paper
Publications
6 results at SPIE Advanced Lithography + Patterning 2024
EUV patterned gate variation reduction in next generation transistor architectures
- Gopal Kenath
- Martin Burkhardt
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paperNovel ellipsometry-based machine learning technique for characterization of low sensitivity critical dimensions within gate-all-around transistors
- Houssam Chouaib
- Valeria Dimastrodonato
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paperFrom Lab to Fab - In-line SIMS for Process Control in Nanosheet Gate-All-Around Device Manufacturing
- Stefan Schoeche
- Katherine Sieg
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paperLarge Feature Wafer Level In-Line Optical Metrology Techniques for Advanced Packaging Schemes
- Katherine Sieg
- Chris Bottoms
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paperEUV Double Patterning Solution for Subtractive Metal Patterning at 18nm Pitch
- Chris Penny
- Koichi Motoyama
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Invited talk