Publications

Multi-reticle stitching: Applications from packaging to High-NA EUV
- - Chris Bottoms
  - Rick Johnson
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
Guided Random Synthetic Layout Generation and Machine-Learning Based Defect Prediction for Leading Edge Technology Node Development
- - Geng Han
  - Mohamed Talbi
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
Wet clean oxidation for optimal line width and LER
- - Steven McDermott
  - Keith Donegan
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
Metrology-Design Co-Optimization for BEOL dimensional characterization using scatterometry
- - Stefan Schoeche
  - Daniel Schmidt
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
A 353mW 112Gb/s Discrete Multitone Wireline Receiver Datapath with Time-Based ADC in 5nm FinFET
- - Jaewon Lee
  - Pier-Andrea Francese
  - et al.
- 2025
- ISSCC 2025
Conference paper
A 6.78MHz Single-Stage Regulating Rectifier with Dual Outputs Simultaneously Charged in a Half Cycle Achieving 92.2% Efficiency and 131mW Output Power
- - Quanrong Zhuang
  - Junyi Sun
  - et al.
- 2025
- ISSCC 2025
Conference paper
Dynamic Guard-Band Features of the IBM zNext System
- - Tobias Webel
  - Phillip J. Restle
  - et al.
- 2025
- ISSCC 2025
Conference paper
IBM Telum II Processor Design-Technology Co-Optimizations for Power, Performance, Area and Reliability
- - David Wolpert
  - Gerry Strevig
  - et al.
- 2025
- ISSCC 2025
Conference paper
IBM Telum II: Next Generation 5.5GHz Microprocessor with On-Die Data Processing Unit and Improved AI Accelerator
- - Gerald Strevig
  - Chris Berry
  - et al.
- 2025
- ISSCC 2025
Conference paper
Graph-based Uncertainty Metrics for Long-form Language Model Generations
- - Mingjian Jiang
  - Yangjun Yangjun
  - et al.
- 2024
- NeurIPS 2024
Conference paper