Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
Publications
802 results for Semiconductors
Reliable Sub-nanosecond MRAM with Double Spin-torque Magnetic Tunnel Junctions
- C. Safranski
- G. Hu
- et al.
- 2022
- VLSI Technology and Circuits 2022
A 72GS/s, 8-bit DAC-based Wireline Transmitter in 4nm FinFET CMOS for 200+Gb/s Serial Links
- Timothy Dickson
- Zeynep Deniz
- et al.
- 2022
- VLSI Technology and Circuits 2022
Evaluating compressed indexes in DBMS
- Oz Anani
- Gal Lushi
- et al.
- 2022
- SYSTOR 2022
Quantifying Composable Data Center Utilization
- Marc Taubenblatt
- Asser Tantawi
- 2022
- COMPSYS 2022
Evaluating Hardware Memory Disaggregation under Delay and Contention
- Archit Patke
- Haoran Qiu
- et al.
- 2022
- IPDPS 2022
An Integrated Photonics Engine for Unsupervised Correlation Detection
- Ghazi Sarwat Syed
- Frank Brückerhoff-plückelmann
- et al.
- 2022
- Science Advances
A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022