Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Publications
778 results for Semiconductors
Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- Atom O. Watanabe
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- Katsuyuki Sakuma
- Griselda Bonilla
- et al.
- 2023
- ECTC 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- Toyohiro Aoki
- Katsuyuki Sakuma
- et al.
- 2023
- ECTC 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- Griselda Bonilla
- 2023
- iTHERM 2023
SUSTAINABLE COMPUTING – THERMAL CHALLENGES AND OPPORTUNITIES
- 2023
- iTHERM 2023
Module, antenna, and package design considerations for mm-scale IoT devices
- Arun Paidimarri
- Duixian Liu
- et al.
- 2023
- ECTC 2023
Heterojunctions in Integrated Hybrid III-V/Si Photonic Crystal Emitters
- Markus Scherrer
- Enrico Brugnolotto
- et al.
- 2023
- CSW 2023
Acceleration of Decision-Tree Ensemble Models on the IBM Telum Processor
- Nikolaos Papandreou
- Jan Van Lunteren
- et al.
- 2023
- ISCAS 2023
Architectures and Circuits for Analog-memory-based Hardware Accelerators for Deep Neural Networks
- Sidney Tsai
- Pritish Narayanan
- et al.
- 2023
- ISCAS 2023