Publications

Vacuum underfill technology for advanced packaging
- - Akihiro Horibe
  - M.-C. Paquet
  - et al.
- 2011
- ECTC 2011
Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- - Yasumitsu Orii
  - Kazushige Toriyama
  - et al.
- 2011
- ECTC 2011
Angelic debugging
- - Satish Chandra
  - Emina Torlak
  - et al.
- 2011
- ICSE 2011
Blending freeform and managed information in tables (NIER track)
- - Nicolas Mangano
  - Harold Ossher
  - et al.
- 2011
- ICSE 2011
Code coverage analysis in practice for large systems
- - Yoram Adler
  - Noam Behar
  - et al.
- 2011
- ICSE 2011
Second international workshop on Product Line Approaches in Software Engineering (PLEASE 2011)
- - Julia Rubin
  - Goetz Botterweck
  - et al.
- 2011
- ICSE 2011
Sketching tools for ideation (NIER track)
- - Rachel Bellamy
  - Michael Desmond
  - et al.
- 2011
- ICSE 2011
A framework for automated testing of JavaScript web applications
- - Shay Artzi
  - Julian Dolby
  - et al.
- 2011
- ICSE 2011
Workshop on flexible modeling tools (FlexiTools 2011)
- - Harold Ossher
  - André Van Der Hoek
  - et al.
- 2011
- ICSE 2011
Using MATCON to generate CASE tools that guide deployment of pre-packaged applications
- - Elad Fein
  - Natalia Razinkov
  - et al.
- 2011
- ICSE 2011