Publications

Solder/adhesive bonding using simple planarization technique for 3D integration
- - Masatsugu Nimura
  - Jun Mizuno
  - et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- - Paul Andry
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- - Jae-Woong Nah
  - Michael A. Gaynes
  - et al.
- 2011
- ECTC 2011
Electromagnetic-SPICE modeling and analysis of 3D power network
- - Zheng Xu
  - Jian-Qiang Lu
  - et al.
- 2011
- ECTC 2011
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- - Katsuyuki Sakuma
  - Kazushige Toriyama
  - et al.
- 2011
- ECTC 2011
High-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
- - Masao Tokunari
  - Yutaka Tsukada
  - et al.
- 2011
- ECTC 2011
A through-silicon-via to active device noise coupling study for CMOS SOI technology
- - Xiaomin Duan
  - Xiaoxiong Gu
  - et al.
- 2011
- ECTC 2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- - Joana Maria
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
- - Fengda Sun
  - Yusuf Leblebici
  - et al.
- 2011
- ECTC 2011
Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- - Yasumitsu Orii
  - Kazushige Toriyama
  - et al.
- 2011
- ECTC 2011