Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2010
- ECTC 2010
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Direct measurement of local stress in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2010
- ECTC 2010
Scalable parametric verification of secure systems: How to verify reference monitors without worrying about data structure size
- Jason Franklin
- Sagar Chaki
- et al.
- 2010
- S&P 2010
Efficient full-wave modeling of high density TSVs for 3D integration
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2010
- ECTC 2010
Dense 24 TX + 24 RX fiber-coupled optical module based on a holey CMOS transceiver IC
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2010
- ECTC 2010
Electrical characterization of 3D Through-Silicon-Vias
- Fei Liu
- Xiaoxiong Gu
- et al.
- 2010
- ECTC 2010
Novel adhesive development for CMOS-compatible thin wafer handling
- K. Tamura
- K. Nakada
- et al.
- 2010
- ECTC 2010
Morphable memory system: A robust architecture for exploiting multi-level phase change memories
- Moinuddin K. Qureshi
- Michele M. Franceschini
- et al.
- 2010
- ISCA 2010
The Virtual Write Queue: Coordinating DRAM and last-level cache policies
- Jeffrey Stuecheli
- Dimitris Kaseridis
- et al.
- 2010
- ISCA 2010
A HOT - Human, Organizational and Technological - Framework for a software engineering course
- Orit Hazzan
- Yael Dubinsky
- 2010
- ICSE 2010