Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders
- Sun-Kyoung Seo
- Moon Gi Cho
- et al.
- 2011
- ECTC 2011
Publications
Date
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Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
High performance wafer level underfill material with high filler loading
- Satoru Katsurayama
- Hiroshi Suzuki
- et al.
- 2011
- ECTC 2011
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Vacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
Using MATCON to generate CASE tools that guide deployment of pre-packaged applications
- Elad Fein
- Natalia Razinkov
- et al.
- 2011
- ICSE 2011
Code coverage analysis in practice for large systems
- Yoram Adler
- Noam Behar
- et al.
- 2011
- ICSE 2011
Workshop on flexible modeling tools (FlexiTools 2011)
- Harold Ossher
- André Van Der Hoek
- et al.
- 2011
- ICSE 2011
Angelic debugging
- Satish Chandra
- Emina Torlak
- et al.
- 2011
- ICSE 2011
Second international workshop on Product Line Approaches in Software Engineering (PLEASE 2011)
- Julia Rubin
- Goetz Botterweck
- et al.
- 2011
- ICSE 2011