Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding
- K.N. Chen
- T.M. Shaw
- et al.
- 2010
- IEDM 2010
Conference paper
Publications
Wafer scale fabrication of carbon nanotube FETs with embedded poly-gates
- Shu-Jen Han
- Josephine Chang
- et al.
- 2010
- IEDM 2010
Conference paperHigh on-off ratio bilayer graphene complementary field effect transistors
- Kausik Majumdar
- Kota V. R. M. Murali
- et al.
- 2010
- IEDM 2010
Conference paperThe impact of hole-induced electromigration on the cycling endurance of phase change memory
- M. H. Lee
- R. Cheek
- et al.
- 2010
- IEDM 2010
Conference paperCombined iterative and model-driven optimization in an automatic parallelization framework
- Louis-Noël Pouchet
- Uday Bondhugula
- et al.
- 2010
- SC 2010
Conference paperThe turtles project: Design and implementation of nested virtualization
- Muli Ben-Yehuda
- Michael D. Day
- et al.
- 2010
- OSDI 2010
Conference paperThe role of machine learning in business optimization
- Chid Apte
- 2010
- ICML 2010
Conference paperLearning temporal causal graphs for relational time-series analysis
- Yan Liu
- Alexandru Niculescu-Mizil
- et al.
- 2010
- ICML 2010
Conference paperNonparametric return distribution approximation for reinforcement learning
- Tetsuro Morimurat
- Masashi Sugiyama
- et al.
- 2010
- ICML 2010
Conference paperPareto sampling: Choosing the right weights by Derivative Pursuit
- Amith Singhee
- Pamela Castalino
- 2010
- DAC 2010
Conference paper