Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications
- Xiaoxiong Gu
- Dong Gun Kam
- et al.
- 2013
- ECTC 2013
Publications
No Clean Flux technology for large die flip chip packages
- Akihiro Horibe
- Kang-Wook Lee
- et al.
- 2013
- ECTC 2013
Power delivery modeling for 3D systems with non-uniform TSV distribution
- Huanyu He
- Zheng Xu
- et al.
- 2013
- ECTC 2013
Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- Kang-Wook Lee
- Stephane Barbeau
- et al.
- 2013
- ECTC 2013
Single-chip 4 TX + 4 RX optical module based on holey SiGe transceiver IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2013
- ECTC 2013
Investigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders
- Sung K. Kang
- Jaewon Chang
- et al.
- 2013
- ECTC 2013
Map task scheduling in MapReduce with data locality: Throughput and heavy-traffic optimality
- Weina Wang
- Kai Zhu
- et al.
- 2013
- INFOCOM 2013
Hybrid client-server and peer-to-peer caching systems with selfish peers
- Youngmi Jin
- Yung Yi
- et al.
- 2013
- INFOCOM 2013
On the impact of global information on diffusion of innovations over social networks
- Youngmi Jin
- Jungseul Ok
- et al.
- 2013
- INFOCOM 2013