Publications

13 results at InterPACK 2015

Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- - Arvind Sridhar
  - Chin Lee Ong
  - et al.
- 2015
- InterPACK 2015
Validation study for VOF simulations of boiling in a microchannel
- - Catherine Gorle
  - Hyoungsoon Lee
  - et al.
- 2015
- InterPACK 2015
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- - Hiroyuki Mori
  - Sayuri Kohara
  - et al.
- 2015
- InterPACK 2015