Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- Arvind Sridhar
- Chin Lee Ong
- et al.
- 2015
- InterPACK 2015
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13 results at InterPACK 2015
Effect of relative humidity, Temperature and gaseous and particulate contaminations on information technology equipment reliability
- Prabjit Singh
- Levente J. Klein
- et al.
- 2015
- InterPACK 2015
LID-integral cold plate topology integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2015
- InterPACK 2015
Integrate monolithic nanostructures in microchannels to enhance flow boiling heat transfer of HFE-7000
- Fanghao Yang
- Xiaochuan Li
- et al.
- 2015
- InterPACK 2015
Eulerian multiphase conjugate model for chip-embedded microchannel flow boiling
- Pritish R. Parida
- Hsin-Hua Tsuei
- et al.
- 2015
- InterPACK 2015
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- Hiroyuki Mori
- Sayuri Kohara
- et al.
- 2015
- InterPACK 2015
Benchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2015
- InterPACK 2015
Energy efficiency and air quality considerations in airside economized data centers
- Levente J. Klein
- Sergio A. Bermudez
- et al.
- 2015
- InterPACK 2015
Reduced order modeling for chip-embedded micro-channel flow boiling
- 2015
- InterPACK 2015
Discrete control of air conditioning units in mission critical facilities
- Sergio A. Bermudez
- Hendrik Hamann
- et al.
- 2015
- InterPACK 2015