A 90.4% Peak Efficiency 48V/1V Three-Level Hybrid Dickson Converter with Gradient Descent Run-Time Optimizer and GaN/Si Hybrid Conversion
- Minxiang Gong
- Xin Zhang
- et al.
- 2022
- VLSI Technology and Circuits 2022
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A 0.31V Vmin Cryogenic SRAM in 14 nm FinFET for Quantum Computing
- Rajiv V. Joshi
- J. Timmerwilke
- et al.
- 2022
- VLSI Technology and Circuits 2022
Giallar: push-button verification for the qiskit Quantum compiler
- Runzhou Tao
- Yunong Shi
- et al.
- 2022
- PLDI 2022
Practical Non-interactive Publicly Verifiable Secret Sharing with Thousands of Parties
- Craig Gentry
- Shai Halevi
- et al.
- 2022
- Eurocrypt 2022
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- Keiji Matsumoto
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Zero-Knowledge IOPs with Linear-Time Prover and Polylogarithmic-Time Verifier
- Jonathan Bootle
- Alessandro Chiesa
- et al.
- 2022
- Eurocrypt 2022
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022