Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
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Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Sine Series Approximation of the Mod Function for Bootstrapping of Approximate HE
- Charanjit Jutla
- Nathan Manohar
- 2022
- Eurocrypt 2022
Group Signatures and More from Isogenies and Lattices: Generic, Simple, and Efficient
- Ward Beullens
- Samuel Dobson
- et al.
- 2022
- Eurocrypt 2022
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Quality Controlled Paraphrase Generation
- Elron Bandel
- Ranit Aharonov
- et al.
- 2022
- ACL 2022
Constrained Multi-Task Learning for Bridging Resolution
- Hideo Kobayashi
- Yufang Hou
- 2022
- ACL 2022
On The Ingredients of an Effective Zero-shot Semantic Parser
- Pengcheng Yin
- John Wieting
- et al.
- 2022
- ACL 2022
Educational Question Generation of Children Storybooks via Question Type Distribution Learning and Event-Centric Summarization
- Zhenjie Zhao
- Yufang Hou
- et al.
- 2022
- ACL 2022