Publications

35 results for Mark D. Schultz

Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- - John U. Knickerbocker
  - Jean Benoit Herou
  - et al.
- 2025
- ECTC 2025
Photonic Modules with High Density Polymer Waveguide Interface
- - J.B. Héroux
  - A. Paz Ramos
  - et al.
- 2025
- OFC 2025
Photonic Modules with High Density Polymer Waveguide Interface
- - J.B. Heroux
  - A. Paz Ramos
  - et al.
- 2025
- OFC 2025
Compliant Direct Attach Liquid Cooling
- - Mark D. Schultz
  - Pritish R. Parida
- 2024
- ITherm 2024
An 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing
- - Daniel M. Kuchta
  - Mounir Meghelli
  - et al.
- 2022
- ECOC 2022
MOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
- - Daniel M. Kuchta
  - Mounir Meghelli
  - et al.
- 2022
- Networks 2022
Microprocessor Performance with Multiple Cooling Approaches
- - Mark D. Schultz
  - Pritish R. Parida
  - et al.
- 2022
- ITherm 2022
High Performance Compliant Heat Sinks
- - Mark D. Schultz
- 2022
- ITherm 2022
Summit and Sierra supercomputer cooling solutions
- - Shurong Tian
  - Todd Takken
  - et al.
- 2020
- IBM J. Res. Dev
A single flexible coldplate cools multiple devices
- - Shurong Tian
  - Todd Takken
  - et al.
- 2019
- ITherm 2019