A through-silicon-via to active device noise coupling study for CMOS SOI technology
- Xiaomin Duan
- Xiaoxiong Gu
- et al.
- 2011
- ECTC 2011
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8 results for Joungho Kim
Discontinuity cancellation to boost package bandwidth up to material's limitations - 40 Gbps package design using wire-bonded PBGA
- Dong Gun Kam
- Joungho Kim
- 2007
- IMAPS 2007
Foreword special section on through silicon vias
- Dong Gun Kam
- Joungho Kim
- 2011
- IEEE Transactions on CPMT
Inductance calculations for plane-pair area fills with vias in a power distribution network using a cavity model and partial inductances
- Jingook Kim
- Jun Fan
- et al.
- 2011
- IEEE T-MTT
Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure
- Jongjoo Shim
- Dong Gun Kam
- et al.
- 2010
- IEEE Trans Electromagn Compat
Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed Printed Circuit Boards (PCBs) based on a time-domain even-mode and odd-mode analysis
- Gawon Kim
- Dong Gun Kam
- et al.
- 2008
- IEEE T-MTT
40-Gb/s package design using wire-bonded plastic ball grid array
- Dong Gun Kam
- Joungho Kim
- 2008
- IEEE Transactions on Advanced Packaging
Multiport measurement method using a two-port network analyzer with remaining ports unterminated
- Dong Gun Kam
- Joungho Kim
- 2007
- IEEE MWCL