About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEEE Transactions on Advanced Packaging
Paper
40-Gb/s package design using wire-bonded plastic ball grid array
Abstract
A 40-Gb/s packaging solution that uses low-cost wire-bonded plastic ball grid array (WB-PBGA) technology is presented. Since such a high speed was beyond the reach of conventional package designs, a new design methodology was proposed-discontinuity cancellation in both signal-current and return-current paths. The 3-D structures of bonding wires, vias, solder ball pads, and power distribution networks were optimized for the discontinuity cancellation. Two versions of four-layer WB-PBGA packages were designed; one according to the proposed methodology and the other conventionally. The proposed design methodology was verified with full-wave simulation, passive bandwidth measurement, time domain reflectometry (TDR), eye diagram measurement, and jitter analysis. © 2008 IEEE.