Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- C. J. Penny
- S. Gates
- et al.
- 2017
- IITC 2017
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70 results for Griselda Bonilla
Tri-layer nanoindentation for mechanical characterization of ultra-low-k dielectrics
- Tingge Xu
- Yingjie Du
- et al.
- 2017
- IITC 2017
Methods to lower the resistivity of ruthenium interconnects at 7 nm node and beyond
- Xunyuan Zhang
- Huai Huang
- et al.
- 2017
- IITC 2017
A stochastic model for impact of LER on BEOL TDDB
- Ramachandran Muralidhar
- Ernest Y. Wu
- et al.
- 2017
- IRPS 2017
A new and holistic modelling approach for impact of line-edge roughness on dielectric reliability
- Ernest Y. Wu
- Ramachandran Muralidhar
- et al.
- 2017
- IRPS 2017
Towards an appropriate acceleration model for beol tddb
- Ramachandran Muralidhar
- Eric G. Liniger
- et al.
- 2016
- IRPS 2016
Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications
- Ernest Y. Wu
- James Stathis
- et al.
- 2016
- IRPS 2016
The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2016
- IRPS 2016
Interconnect performance and scaling strategy at the 5 nm Node
- James H.-C. Chen
- N.V. Licausi
- et al.
- 2016
- IITC/AMC 2016
BEOL process integration for the 7 nm technology node
- T. Standaert
- Genevieve Beique
- et al.
- 2016
- IITC/AMC 2016