Top-down topography of deeply etched silicon in the scanning electron microscope
- Oliver C. Wells
- Conal E. Murray
- et al.
- 2004
- Review of Scientific Instruments
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116 results for Conal Murray
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
High-mobility ultrathin semiconducting films prepared by spin coating
- David B. Mitzi
- Laura L. Kosbar
- et al.
- 2004
- Nature
Strain effects in thin film/Si substrates revealed by X-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2004
- Powder Diffraction
Elastic strain relaxation in free-standing SiGe/Si structures
- P.M. Mooney
- G.M. Cohen
- et al.
- 2004
- Applied Physics Letters
Probing strain fields about thin film structures using x-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2003
- MRS Proceedings 2003
Moisture and oxygen uptake in Low K/ copper interconnect structures
- T.M. Shaw
- D. Jimerson
- et al.
- 2003
- ADMETA 2003
Mapping of strain fields about thin film structures using x-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2003
- Applied Physics Letters
Liner materials for direct electrodeposition of Cu
- M.W. Lane
- C.E. Murray
- et al.
- 2003
- Applied Physics Letters