Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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11 results for Cheng Chi

Speeding up OPC by leveraging existing designs with machine learning
- - Cheng Chi
  - Julian Dolby
  - et al.
- 2021
- SPIE Advanced Lithography 2021
LCDU improvement of EUV-patterned vias with DSA
- - Jing Guo
  - Dustin W. Janes
  - et al.
- 2019
- MEMS/NEMS/MOEMS 2019
The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
- - Chi-Chun Liu
  - Yann Mignot
  - et al.
- 2018
- SPIE Advanced Lithography 2018
DSA patterning options for logics and memory applications
- - Chi Chun Liu
  - Elliott Franke
  - et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- - Cheng Chi
  - Chi Chun Liu
  - et al.
- 2017
- SPIE Advanced Lithography 2017
Advanced fast 3D DSA model development and calibration for design technology co-optimization
- - Kafai Lai
  - Balint Meliorisz
  - et al.
- 2017
- SPIE Advanced Lithography 2017
Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer
- - Indira Seshadri
  - Anuja De Silva
  - et al.
- 2017
- SPIE Advanced Lithography 2017
DSA via hole shrink for advanced node applications
- - Cheng Chi
  - Chi Chun Liu
  - et al.
- 2016
- SPIE Advanced Lithography 2016
Strategies to enable directed self-Assembly contact hole shrink for tight pitches
- - Kristin Schmidt
  - Hitoshi Osaki
  - et al.
- 2016
- SPIE Advanced Lithography 2016
Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer
- - Indira Seshadri
  - Anuja De Silva
  - et al.
- 2017
- J. Micro/Nanolithogr. MEMS MOEMS