Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

27 results for E. A. Joseph

Resistivity of copper interconnects beyond the 7 nm node
- - Adam Pyzyna
  - R. L. Bruce
  - et al.
- 2015
- VLSI Technology 2015
Defect mitigation of plasma-induced delamination of TiW/Cu from SiN_x layer in thin si interposer processing with glass carriers
- - Vijay Sukumaran
  - Thuy Tran-Quinn
  - et al.
- 2015
- ECTC 2015
Electrical characterization of FinFETs with fins formed by directed self assembly at 29 nm fin pitch using a self-aligned fin customization scheme
- - Hsinyu Tsai
  - H. Miyazoe
  - et al.
- 2014
- IEDM 2014
An integrated silicon photonics technology for O-band datacom
- - N. Feilchenfeld
  - Frederick A. Anderson
  - et al.
- 2015
- IEDM 2015
Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules
- - Chao Wang
  - Sung Wook Nam
  - et al.
- 2017
- Nature Communications
Critical BEOL aspects of the fabrication of a thermally-assisted MRAM device
- - E.J. O'sullivan
  - D. Edelstein
  - et al.
- 2015
- ECS Meeting 2015 Phoenix
Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm²
- - Adam Pyzyna
  - Hsinyu Tsai
  - et al.
- 2017
- IITC 2017
Evaluation of ALE processes for patterning
- - J. M. Papalia
  - Nathan Marchack
  - et al.
- 2016
- SPIE Advanced Lithography 2016
High chi block copolymer DSA to improve pattern quality for FinFET device fabrication
- - Hsinyu Tsai
  - H. Miyazoe
  - et al.
- 2016
- SPIE Advanced Lithography 2016
Moving from thin films to atomic layers - Atomic layer etching
- - Craig Huffman
  - E. A. Joseph
  - et al.
- 2015
- VLSI-TSA 2015