AI for Advanced Materials in Integration and Packaging

Power densities of high-end computing systems continue to increase, with shipping rack power requirements of 120 kW and roadmaps to 600 kW. Similarly, the complexity of each package has gone from single-die structures to multi-die interposers to direct chip to chip bonding and chip packaged optics. While there are opportunities for improvements in device efficiency, there are also open areas for innovation in how heat is removed from the package, including on- and off-chip thermal interface materials, mechanical support materials, and working fluids for cooling. In this talk I will offer a perspective on where AI-based materials discovery can have a significant impact, and where gaps remain.