Publications

7 results for Sathya Raghavan

Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- - Sathya Raghavan
  - Ben Yang
  - et al.
- 2025
- ECTC 2025
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- - Divya Taneja
  - Jonathan Grenier
  - et al.
- 2024
- ECTC 2024
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- - Prabudhya Roy Chowdhury
  - Sathya Raghavan
  - et al.
- 2023
- ECTC 2023
Voids-free Die-level Cu/ILD Hybrid bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Risa Miyazawa
  - et al.
- 2023
- ECTC 2023
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- - Sathya Raghavan
  - Aakrati Jain
  - et al.
- 2023
- ECTC 2023
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- - Prabudhya Roy Chowdhury
  - Katsuyuki Sakuma
  - et al.
- 2022
- ECTC 2022