Reliable Chiplet Integration on High Density Laminate (2.X D) for AI HardwareDivya TanejaJonathan Grenieret al.2024ECTC 2024
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing ApplicationsAakrati JainRisa Miyazawaet al.2023ECTC 2023
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine LearningSathya RaghavanAakrati Jainet al.2023ECTC 2023
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D PackagesPrabudhya Roy ChowdhurySathya Raghavanet al.2023ECTC 2023
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join ProcessPrabudhya Roy ChowdhuryKatsuyuki Sakumaet al.2022ECTC 2022