Comparison of transient and static test methods for chip-to-sink thermal interface characterization
- B. Smith
- T. Brunschwiler
- et al.
- 2009
- Microelectronics Journal
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154 results for Thomas Brunschwiler
Toward zero-emission data centers through direct reuse of thermal energy
- T. Brunschwiler
- B. Smith
- et al.
- 2009
- IBM J. Res. Dev
Design of thermal interfaces with embedded microchannels to control bond line formation
- Brian Smith
- Hugo Rothuizen
- et al.
- 2008
- ITherm 2008
Forced convective interlayer cooling in vertically integrated packages
- Thomas Brunschwiler
- Bruno Michel
- et al.
- 2008
- ITherm 2008
Interlayer cooling potential in vertically integrated packages
- T. Brunschwiler
- Bruno Michel
- et al.
- 2008
- Microsystem Technologies
High-performance thermal interface technology overview
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- THERMINIC 2007
Utility of transient testing to characterize thermal interface materials
- B. Smith
- T. Brunschwiler
- et al.
- 2007
- THERMINIC 2007
Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- SEMI-THERM 2007
Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
- Thomas Brunschwiler
- Urs Kloter
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
Direct liquid jet-impingement cooling with micronsized nozzle array and distributed return architecture
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2006
- ITherm 2006