Publications

38 results for Dureseti Chidambarrao

Predictive Simulations and Experimental Study of AlN Bonding for Better Thermal Dissipation in BSPDN
- - Sarabjot Singh
  - Sangshin Jang
  - et al.
- 2025
- IITC 2025
Fast And Accurate Machine Learning Prediction of Back-End-Of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- - Prabudhya Roy Chowdhury
  - Aakrati Jain
  - et al.
- 2025
- ECTC 2025
IBM Telum II Processor Design-Technology Co-Optimizations for Power, Performance, Area and Reliability
- - David Wolpert
  - Gerry Strevig
  - et al.
- 2025
- ISSCC 2025
Gate Resistance Test Structures Bounded by Local Layout Density to Characterize Metal Gate Height Variation in 7nm FinFET Technology
- - Justin Zhu
  - Katsunori Onishi
  - et al.
- 2024
- IEEE MDTS 2024
Cores, Cache, Content, and Characterization: IBM’s Second Generation 14-nm Product, z15
- - David Wolpert
  - Chris Berry
  - et al.
- 2020
- IEEE JSSC
IBM z15: Physical design improvements to significantly increase content in the same technology
- - Christopher Berry
  - David Wolpert
  - et al.
- 2020
- IBM J. Res. Dev
IBM z15: A 12-Core 5.2GHz Microprocessor
- - Christopher Berry
  - Brian Bell
  - et al.
- 2020
- ISSCC 2020
IBM z14: Processor characterization and power management for high-reliability mainframe systems
- - Christopher Berry
  - David Wolpert
  - et al.
- 2019
- IEEE JSSC
Identification and sensitivity analysis of a correlated ground rule system (design arc)
- - Eric Eastman
  - Dureseti Chidambarrao
  - et al.
- 2017
- SPIE Advanced Lithography 2017
High performance 14nm SOI FinFET CMOS technology with 0.0174μm² embedded DRAM and 15 levels of Cu metallization
- - C.-H.C-H. Lin
  - Brian Greene
  - et al.
- 2014
- IEDM 2014