Predictive Simulations and Experimental Study of AlN Bonding for Better Thermal Dissipation in BSPDN
- Sarabjot Singh
- Sangshin Jang
- et al.
- 2025
- IITC 2025
Publications
39 results for Dureseti Chidambarrao
Fast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Prabudhya Roy Chowdhury
- Aakrati Jain
- et al.
- 2025
- ECTC 2025
IBM Telum II Processor Design-Technology Co-Optimizations for Power, Performance, Area and Reliability
- David Wolpert
- Gerry Strevig
- et al.
- 2025
- ISSCC 2025
IBM Telum II Microprocessor: 5.5 GHz With On-Die AI and Data Processing, and Design–Technology Co-Optimizations for Power, Area, and Reliability
- Gerald Strevig
- David Wolpert
- et al.
- 2025
- IEEE Journal of Solid State Circuits
Gate Resistance Test Structures Bounded by Local Layout Density to Characterize Metal Gate Height Variation in 7nm FinFET Technology
- Justin Zhu
- Katsunori Onishi
- et al.
- 2024
- IEEE MDTS 2024
Cores, Cache, Content, and Characterization: IBM’s Second Generation 14-nm Product, z15
- David Wolpert
- Chris Berry
- et al.
- 2020
- IEEE JSSC
IBM z15: Physical design improvements to significantly increase content in the same technology
- Christopher Berry
- David Wolpert
- et al.
- 2020
- IBM J. Res. Dev
IBM z15: A 12-Core 5.2GHz Microprocessor
- Christopher Berry
- Brian Bell
- et al.
- 2020
- ISSCC 2020
IBM z14: Processor characterization and power management for high-reliability mainframe systems
- Christopher Berry
- David Wolpert
- et al.
- 2019
- IEEE JSSC
Identification and sensitivity analysis of a correlated ground rule system (design arc)
- Eric Eastman
- Dureseti Chidambarrao
- et al.
- 2017
- SPIE Advanced Lithography 2017