Stress gradients observed in Cu thin films induced by capping layers
- Conal E. Murray
- Paul R. Besser
- et al.
- 2009
- MRS Spring Meeting 2009
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21 results for C. Witt
Ultra low contact resistivities for CMOS beyond 10-nm node
- Zhen Zhang
- Siyuranga Obasa Koswatta
- et al.
- 2013
- IEEE Electron Device Letters
Resistance contributions to copper interconnects
- C. Witt
- F. Baumann
- et al.
- 2017
- IITC 2017
Resistivity of copper interconnects beyond the 7 nm node
- Adam Pyzyna
- Robert L. Bruce
- et al.
- 2015
- VLSI Technology 2015
Effect of impurity on Cu electromigration
- C.-K. Hu
- Matthew Angyal
- et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Copper microstructure: Effect on electromigration void evolution
- C. Witt
- V. Calero
- et al.
- 2010
- ADMETA 2010
New failure mechanism during high temperature storage testing and its application on SIV risk evaluation
- O. Aubel
- W. Yao
- et al.
- 2009
- IIRW 2009
The evolution of barrier properties during reliability testing of Cu interconnects
- M.A. Meyer
- O. Aubel
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Stress relaxation in Cu thin films
- C. Witt
- R. Rosenberg
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Electromigration: Void dynamics
- C. Witt
- V. Calero
- et al.
- 2016
- IEEE T-DMR