Publications

43 results for Nick Fuller

Effect of radical species density and ion bombardment during ashing of extreme ultralow- κ interlevel dielectric materials
- - M.A. Worsley
  - S. Bent
  - et al.
- 2007
- Journal of Applied Physics
Analysis of plasma-induced modification of ULK and eULK Materials: Dual damascene processing challenges for 45nm (κ ≤ 2.4) and beyond BEOL technologies
- - N. Fuller
  - M.A. Worsley
  - et al.
- 2006
- IITC 2006
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- - S. Sankaran
  - S. Arai
  - et al.
- 2006
- IEDM 2006
Post implant strip optimization for 90nm and beyond technologies
- - Nicholas C. M. Fuller
  - Anthony Santiago
  - et al.
- 2006
- ASMC 2006
BEOL integration of highly damage -resistant porous ultra low-k material using direct CMP and via-first process
- - T. Iijima
  - Q. Lin
  - et al.
- 2006
- IITC 2006
Characterization of neutral species densities in dual frequency capacitively coupled photoresist ash plasmas by optical emission actinometry
- - M.A. Worsley
  - S. Bent
  - et al.
- 2006
- Journal of Applied Physics
Nanoporous materials integration into advanced microprocessors
- - E. Todd Ryan
  - Cathy Labelle
  - et al.
- 2005
- MRS Spring Meeting 2005
Plasma induced dielectric modification: Etching challenges for 65nm and beyond technology nodes
- - N. Fuller
  - M.A. Worsley
  - et al.
- 2005
- ISTC 2005
Effect of plasma interactions with low-κ films as a function of porosity, plasma chemistry, and temperature
- - Marcus A. Worsley
  - Stacey F. Bent
  - et al.
- 2005
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Aggressively scaled (0.143 μm ²) 6T-SRAM cell for the 32 nm node and beyond
- - D. Fried
  - J. Hergenrother
  - et al.
- 2004
- IEDM 2004