Publications

64 results for Nick Lanzillo

Unconventional resistivity scaling in topological semimetal CoSi
- - Shang-Wei Lien
  - Ion Garate
  - et al.
- 2023
- npj Quantum Materials
Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- - C. J. Penny
  - Koichi Motoyama
  - et al.
- 2022
- IEDM 2022
Size-Dependent Grain-Boundary Scattering in Topological Semimetals
- - Nicholas A. Lanzillo
  - Utkarsh Bajpai
  - et al.
- 2022
- Physical Review Applied
Reliability and resistance projections for rhodium and iridium interconnects from first-principles
- - Nicholas A. Lanzillo
  - Daniel C. Edelstein
- 2022
- Journal of Vacuum Science and Technology B
Capacitive Impacts of Etch-Induced Dielectric Damage in Highly-Scaled Interconnect Architectures
- - Janet M. Wilson
  - Nicholas A. Lanzillo
- 2022
- IITC 2022
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
- - Koichi Motoyama
  - Nicholas A. Lanzillo
  - et al.
- 2022
- IITC 2022
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- - Takeshi Nogami
  - Oleg Gluschenkov
  - et al.
- 2022
- VLSI Technology and Circuits 2022
Evaluating the Potential of Weyl Semimetals as Future Interconnect Metals
- - Sushant Kumar
  - Yi-Hsin Tu
  - et al.
- 2022
- MRS Spring Meeting 2022
Area-Selective Deposition of Tantalum Nitride with Polymerizable Monolayers: From Liquid to Vapor Phase Inhibitors
- - Krystelle Lionti
  - Noel Arellano
  - et al.
- 2022
- Chemistry of Materials
Resistivity scaling in topological semimetal CoSi
- - Hsin Lin
  - Shang-Wei Lien
  - et al.
- 2022
- APS March Meeting 2022