Surface initiated polymer thin films for the area selective deposition and etching of metal oxides
- Thomas G. Pattison
- Alexander E. Hess
- et al.
- 2020
- ACS Nano
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62 results for Nick Lanzillo
Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- Nicholas A. Lanzillo
- Kisik Choi
- et al.
- 2019
- IEEE Electron Device Letters
DTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN
- Minhaz Abedin
- Shahrukh Khan
- et al.
- 2024
- ASMC 2024
DTCO Guided Process Integration: Case Studies from FEOL & BEOL with BSPDN Topic: DTCO/DFM
- Minhaz Abedin
- Shahrukh Khan
- et al.
- 2024
- ASMC 2024
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Capacitive Impacts of Etch-Induced Dielectric Damage in Highly-Scaled Interconnect Architectures
- Janet M. Wilson
- Nicholas A. Lanzillo
- 2022
- IITC 2022
Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects
- Koichi Motoyama
- Nicholas A. Lanzillo
- et al.
- 2022
- IITC 2022
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Comprehensive BEOL Performance Assessment: Interconnects Optimized for Signal Routing and Power Delivery in Advanced CMOS Technology Nodes (Invited)
- Nicholas A. Lanzillo
- Rwik Sengupta
- et al.
- 2020
- IITC 2020
Composite Interconnects for High-Performance Computing beyond the 7nm Node
- P. Bhosale
- S. Parikh
- et al.
- 2020
- VLSI Technology 2020