Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- 2021
- VLSI Technology 2021
Publications
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Year
10 results for P. Bhosale
Composite Interconnects for High-Performance Computing beyond the 7nm Node
- P. Bhosale
- S. Parikh
- et al.
- 2020
- VLSI Technology 2020
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
- T. Nogami
- H. Huang
- et al.
- 2019
- VLSI Technology 2019
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- T. Nogami
- X. Zhang
- et al.
- 2017
- VLSI Technology 2017
Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
- P. Bhosale
- J. Maniscalco
- et al.
- 2018
- IITC 2018
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- T. Nogami
- R. Patlolla
- et al.
- 2017
- IITC 2017
A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects
- Tianji Zhou
- N. Lanzillo
- et al.
- 2018
- AIP Advances
Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes
- Nicholas A. Lanzillo
- Albert Chu
- et al.
- 2021
- IEEE Transactions on VLSI Systems
Spin-dependent electron scattering in cobalt interconnects
- N. Lanzillo
- P. Bhosale
- et al.
- 2019
- Journal of Physics D: Applied Physics
Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
- N. Lanzillo
- Oscar D. Restrepo
- et al.
- 2018
- Applied Physics Letters