Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

10 results for P. Bhosale

Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- - P. Bhosale
- 2021
- VLSI Technology 2021
Composite Interconnects for High-Performance Computing beyond the 7nm Node
- - P. Bhosale
  - S. Parikh
  - et al.
- 2020
- VLSI Technology 2020
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
- - T. Nogami
  - H. Huang
  - et al.
- 2019
- VLSI Technology 2019
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- - T. Nogami
  - X. Zhang
  - et al.
- 2017
- VLSI Technology 2017
Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
- - P. Bhosale
  - J. Maniscalco
  - et al.
- 2018
- IITC 2018
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- - T. Nogami
  - R. Patlolla
  - et al.
- 2017
- IITC 2017
A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects
- - Tianji Zhou
  - N. Lanzillo
  - et al.
- 2018
- AIP Advances
Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes
- - Nicholas A. Lanzillo
  - Albert Chu
  - et al.
- 2021
- IEEE Transactions on VLSI Systems
Spin-dependent electron scattering in cobalt interconnects
- - N. Lanzillo
  - P. Bhosale
  - et al.
- 2019
- Journal of Physics D: Applied Physics
Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
- - N. Lanzillo
  - Oscar D. Restrepo
  - et al.
- 2018
- Applied Physics Letters