Publication
IRPS 2016
Conference paper

Effect of H2O on TDDB for a range of ULK ILD materials with varying damage resistance for robust and weak liners

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Abstract

In this study we look at the correlation between TDDB lifetime, in the presence of intentionally introduced H2O and top surface damage for different ILD materials using a robust liner. The activation energy for the movement of loosely bound physi-adsorbed H2O has been obtained using AC loss measurements. We also explore the role of moisture in drawing Cu out of metal lines through an intentionally-fabricated thin/weak liner under prolonged stress at a relatively low voltage. AC loss, I-V, triangular voltage sweep (TVS) and TDDB measurements all provide evidence that Cu is migrating out of the lines into the ILD.

Date

Publication

IRPS 2016

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