Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

8 results for T. Haigh

Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- - Benjamin D. Briggs
  - C.B. Peethala
  - et al.
- 2017
- IEDM 2017
Selective deposition of AlOx for Fully Aligned Via in nano Cu interconnects
- - Son Van Nguyen
  - H. Shobha
  - et al.
- 2021
- IITC 2021
Novel low k Dielectric materials for nano device interconnect technology
- - Son Van Nguyen
  - H. Shobha
  - et al.
- 2020
- VLSI-TSA 2020
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- - Benjamin D. Briggs
  - C.B. Pcethala
  - et al.
- 2018
- IITC 2018
Method of problem solving to diagnose high particle failures due to unique rotation stopping position: CFM: Contamination free manufacturing
- - Jessica Gruss-Gifford
  - T. Haigh
  - et al.
- 2018
- ASMC 2018
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- - Son Van Nguyen
  - Shobha Hosadugra
  - et al.
- 2017
- ECS Meeting 2017 - New Orleans
BEOL dielectric processing for Cu-Low k nano interconnect-impact of plasma CVD initial transient phenomena (ITP)
- - Son Van Nguyen
  - H. Shobha
  - et al.
- 2016
- PRiME/ECS Meeting 2016
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- - Son Van Nguyen
  - Shobha Hosadugra
  - et al.
- 2017
- ECS J. Solid State Sci. Technol.