Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
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16 results for A. Viehbeck
The Complementary Redox Properties of Viologens and Pyromellitimides: A New Class of Organic Conductors
- Stephen L. Buchwalter
- Revathi Iyengar
- et al.
- 2002
- JACS
Toughened polycyanurate thermosets for electronic applications
- J.C. Hedrick
- Jeffrey T. Gotro
- et al.
- 1994
- International SAMPE Electronics Conference 1994
Organic passivation of copper for MCM-D packaging
- K.-W. Lee
- G.F. Walker
- et al.
- 1994
- International SAMPE Electronics Conference 1994
Etching and deposition of polyimides by electrochemical methods
- A. Viehbeck
- T.R. O'Toole
- et al.
- 1991
- International Conference on Polyimides 1991
Charge-transfer reactions between metals and polyimides
- M.J. Goldberg
- J.G. Clabes
- et al.
- 1988
- ACS PMSE 1988
Electrochemical Properties of Polyimides and Related Imide Compounds
- A. Viehbeck
- M.J. Goldberg
- et al.
- 2019
- JES
Influence of free volume change on the relative permittivity and refractive index in fluoropolyimides
- Gareth Hougham
- Guiliana Tesoro
- et al.
- 1996
- Macromolecules
Broadband characterization of low dielectric constant and low dielectric loss CYTUF™ cyanate ester printed circuit board material
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Future packaging materials: Cost performance, and environmental issues
- J.M. Shaw
- Stephen L. Buchwalter
- et al.
- 1996
- American Chemical Society, Polymer Preprints, Division of Polymer Chemistry