Future packaging materials: Cost performance, and environmental issues

D.Y. Shih, Brian Beaman, et al.

ECTC 1995

Marie Angelopoulos, J.M. Shaw

International SAMPE Technical Conference 1989

D.A. Lewis, S.J. Whitehair, et al.

MRS Spring Meeting 1996

D.Y. Shih, B. Dang, et al.

ICEPT-HDP 2008