Future packaging materials: Cost performance, and environmental issues

M. Hatzakis, K.J. Stewart, et al.

JES

C. Dimitrakopoulos, S. Purushothaman, et al.

Science

J. Paraszczak, E. Babich, et al.

Microelectronic Engineering

A. Afzali, J. Gelorme

MRS Fall Meeting 1995