Fully scaled 0.5 micron CMOS technology using variable shaped electron beam lithography
- Philip Coane
- Paul Rudeck
- et al.
- 1989
- Proceedings of SPIE 1989
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5 results for P. Rudeck
The angular dependence of preferential sputtering and composition in aluminum-copper thin films
- P. Rudeck
- J.M.E. Harper
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Application of variable shaped electron beam technology to the development of 0.5 micron CMOS technology with extensions to 0.25 micron
- P. Coane
- P. Rudeck
- et al.
- 1989
- Microelectronic Engineering
Angular dependence of preferential sputtering and composition in aluminum-copper thin films
- P. Rudeck
- J.M.E. Harper
- et al.
- 1988
- Applied Physics Letters
Electron beam / optical mixed lithography at half-micron ground rules
- P. Coane
- P. Rudeck
- et al.
- 1986
- Microelectronic Engineering