Duixian Liu, Md. Rashidul Islam, et al.
APS 2014
To address the abating performance improvements from device scaling, innovative 2.5-D and 3-D integrated circuits with vertical interconnects called through-silicon vias (TSVs) have been widely explored. This paper reviews TSVs with focus on the following: 1) key drivers for TSV-based integration; 2) TSV fabrication techniques; 3) TSV electrical and thermomechanical performance fundamentals and characterization techniques; and 4) novel technologies to attain enhanced performance beyond the state-of-the-art TSVs.
Duixian Liu, Md. Rashidul Islam, et al.
APS 2014
Duixian Liu, Christian Baks, et al.
APSURSI 2016
Francesco De Paulis, Muhammet Hilmi Nisanci, et al.
EMC 2013
Alina Deutsch, Roger S. Krabbenhoft, et al.
IEEE Trans Electromagn Compat