Publication
VLSI-TSA 2018
Conference paper

Antenna-in-package design and module integration for millimeter-wave communication and 5G

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Abstract

Co-design and integration of RFIC, package, and antennas are critical to enable 5G wireless communications and is particularly challenging at mmWave frequencies. This paper reviews two different aspects of mmWave antenna module packaging and integration for base station and user equipment applications, respectively. We first present the challenges, implementation, and characterization of a 28GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Next, we describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating 4 antennas that supports both normal and end-fire directions for a wide link spatial coverage.

Date

03 Jul 2018

Publication

VLSI-TSA 2018

Authors

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