About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
Annual Proceedings - Reliability Physics (Symposium)
Paper
Softening of breakdown in ultra-thin gate oxide nMOSFETs at low inversion layer density
Abstract
The post breakdown I-V characteristics of ultra-thin gate oxides subjected to constant voltage Fowler-Nordheim stress in nMOSFETs were investigated. It is shown that by varying the electron density through the application of a substrate bias under the same stress field conditions, the oxide degradation does not change while the oxide I-V characteristics after the breakdown event are strongly modified. We have also studied the dependence of the post-breakdown I-V curve on the current compliance used during the constant voltage stress. Finally we speculate on the physical structure of the breakdown spot on the basis of the experimental observations.