Thomas Brunschwiler, Raúl Mroßko, et al.
ESTC 2016
The performance and power efficiency of high-end servers benefit from dense system integration. Accordingly, we introduce a scalable packaging platform supporting high-performance chip stacks, as a continuation in server-system density scaling.
Thomas Brunschwiler, Raúl Mroßko, et al.
ESTC 2016
Jonas Zürcher, Luca Del Carro, et al.
ECTC 2016
Rui Hu, Bruno Michel, et al.
Future Internet
Niccolò Mora, Ferdinando Grossi, et al.
Sensors (Switzerland)