I.K. Pour, D.J. Krajnovich, et al.
SPIE Optical Materials for High Average Power Lasers 1992
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
I.K. Pour, D.J. Krajnovich, et al.
SPIE Optical Materials for High Average Power Lasers 1992
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
E. Burstein
Ferroelectrics
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.