A. Reisman, M. Berkenblit, et al.
JES
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
A. Reisman, M. Berkenblit, et al.
JES
Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering
A. Ney, R. Rajaram, et al.
Journal of Magnetism and Magnetic Materials
Fernando Marianno, Wang Zhou, et al.
INFORMS 2021