C.M. Brown, L. Cristofolini, et al.
Chemistry of Materials
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
C.M. Brown, L. Cristofolini, et al.
Chemistry of Materials
Revanth Kodoru, Atanu Saha, et al.
arXiv
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings
A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990