Abstract
Although the limitations of the meth ods of lithography in use at a particular time are easily recognized and attract substantial attention, experience shows that technological ingenuity keeps push ing them to ever-smaller dimensions. There seems to be no fundamental rea son to expect that lithographic limits will not continue to recede. The limits to the advance of miniaturization are to be found in the ability of materials to with stand high electric fields and in the abili ty of packaging technology to remove heat from active components and pro vide for power distribution, signal inter connection, and flexible mechanical as sembly.