Publication
FiO 2010
Conference paper

Optical package design for silicon photonic chips

Abstract

Silicon photonics is the key to realize higher-bandwidth interconnect with less power consumption and a smaller footprint for the future computer system. When we use silicon photonic chips with the processor, the chips have to be packaged like the today's processor module. We evaluated packaging design options photonics chips with processors for achieving fan-out of the optical signal lines, maintaining mechanical robustness, and signal connection to the external signal paths like the conventional packaging. © 2010 OSA /FiO/LS 2010.

Date

01 Dec 2010

Publication

FiO 2010

Authors

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