Conference paperBimodal electromigration mechanisms in dual-damascene Cu line/via on WC.-K. Hu, L. Gignac, et al.IITC 2002
PaperBackscattered electron imaging in the scanning electron microscope: The use of either: (A) high incident energy or (b) an array detectorL. Gignac, O.C. Wells, et al.Microscopy and Microanalysis
PaperComparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN linersC.-K. Hu, L. Gignac, et al.JES
PaperReduced electromigration of Cu wires by surface coatingC.-K. Hu, L. Gignac, et al.Applied Physics Letters
